1.?2年以上半導體行業(yè)封裝經(jīng)驗(MEMS行業(yè)封裝優(yōu)先).
2.?至少會一種基板繪圖軟件.
3.至少會一種機械結構設計(Solidworks)
4.熟悉LGA封裝制程(DB,WB,SMT)優(yōu)先.
Job?Responsibilities:
1. MEMS?sensor?assembly?and?packaging?design,?prototype?build.
2. Substrate?layout.
3. Assembly?&?packaging?process?and?material?development,?evaluation?and?qualification.
4. Transfer?assembly?&packaging?process?from?prototype?to?mass?production.
5. Documentation?on?process?flow,?process?control,?process?spec,?etc.
6. Process?yield?and?reliability?improvement,?and?failure?analysis?and?actions.
7. Mange?assembly?and?packaging?subcontractor.
Job?Requirements:
1. Bachelor?degree?or?above?in?Material?Science,?Electronics,?Mechanical?Engineering?or?related?engineering?discipline.
2. 2+?years?working?experience?in?semiconductor?assembly?and?packaging?process.
3. Experience?in?laminate?based?packages?–?BGA,?LGA,?Stacked?die.
4. Experience?in?PCB?layout.
5. Knowledge?in?quality?tools?such?as?SPC,?MSA,?Control?Plan,?etc?is?a?plus.
6. Experience?in?sensor?assembly?is?preferred.
7. Fluent?English.