崗位職責(zé):
1.負責(zé)半導(dǎo)體部件釬焊產(chǎn)線的規(guī)劃、釬焊設(shè)備選型、生產(chǎn)線的建設(shè);
2.負責(zé)優(yōu)化半導(dǎo)體部件封裝的釬焊工藝流程,提高生產(chǎn)效率,確保生產(chǎn)穩(wěn)定運行編制作業(yè)文件和現(xiàn)場實施;
3.培訓(xùn)和輔導(dǎo)一線員工的操作技能;
4.新產(chǎn)品、新工藝的封裝技術(shù)的開發(fā)和評價;
5.負責(zé)對制造現(xiàn)場發(fā)生的異常情況進行及時的處置和技術(shù)支持。
6.?熟悉釬焊制程相應(yīng)的環(huán)保法規(guī)及安全要求,確保生產(chǎn)順暢。
任職要求:
1、材料、機械、半導(dǎo)體、微電子等相關(guān)專業(yè),本科及以上學(xué)歷;
2、具有銅、陶瓷、可伐、不銹鋼等封裝材料釬焊5年以上工作經(jīng)驗,熟悉半導(dǎo)體封裝釬焊工藝;
3、?工作勤奮踏實,思維清晰,具有良好的溝通能力及協(xié)調(diào)能力;
Responsibilities:
1.?Be?responsible?for?Brazing?production?line?plan?of?semiconductor?parts,?facility?type?selection?and?production?line?establishment
2.?Optimize?technology?process?of?semiconductor?parts?package,?improve?productivity,?ensure?stability?and?draft?manipulative?documents?and?implementation
3.?Train?and?guide?operators?about?manipulating?skills;?
4.?Develop?and?evaluate?the?package?technology?of?the?new?products?and?new?technology
5.?Be?responsible?for?dealing?with?unusual?situation?during?production?and?provide?technical?support
6.?Familiar?with?brazing?process?and?security?requirements?to?ensure?production?smoothly
Requirements:
1.?bachelor?above,?major?in?material,?technical,?semiconductor,?microelectronics?
2.?at?least?5?years?working?experience?in?copper,?ceramic?or?stainless?steel?packing?brazing?,?familiar?with?the?technology
3.?hardworking,?clear?mind?with?good?coordination?ability